Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023010103
Kind Code:
A
Abstract:
To provide a semiconductor device that combine power supply stabilization with improved heat dissipation performance.SOLUTION: The semiconductor device has a substrate and a semiconductor chip disposed on the substrate, the substrate has a groove opening on the semiconductor chip side, a wiring section of a predetermined pattern is provided inside the groove via an insulating layer, the substrate is connected to the ground wiring of the semiconductor chip, the wiring section is connected to the power wiring of the semiconductor chip, and the wiring section is not exposed from the rear side of the substrate.SELECTED DRAWING: Figure 1
Inventors:
OBA TAKAYUKI
SUGAYA SHINJI
SUGAYA SHINJI
Application Number:
JP2021113963A
Publication Date:
January 20, 2023
Filing Date:
July 09, 2021
Export Citation:
Assignee:
TOKYO INST TECH
ADVANTEST CORP
ADVANTEST CORP
International Classes:
H01L21/822; H01L21/3205; H01L21/82; H01L21/8234; H01L23/36; H01L25/07; H01L27/00
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito