Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023090646
Kind Code:
A
Abstract:
To provide a semiconductor device capable of preventing a process failure and with excellent operating characteristics.SOLUTION: A semiconductor device of an embodiment comprises: a plurality of first conductive lines, a plurality of second conductive lines separated from and crossing the plurality of first conductive lines; and a plurality of memory cells arranged so as to overlap each of intersection regions of the first conductive lines and the second conductive lines between the first conductive lines and the second conductive lines, respectively located in a virtual equilateral triangle apex having three sides each of which is parallel to a first direction, a second direction, and a third direction on a plane, and arranged in a row along each of the first direction, the second direction, and the third direction. Each first conductive line extends in the first direction and overlaps the memory cells arranged in the first direction. Each second conductive line extends in a fourth direction vertical to the first direction and can overlap the memory cells arranged in the fourth direction.SELECTED DRAWING: Figure 2A
Inventors:
SEO SOO MAN
Application Number:
JP2022183626A
Publication Date:
June 29, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
SK HYNIX INC
International Classes:
H10B63/00; H01L29/82; H10B61/00; H10N50/10; H10N70/00; H10N99/00
Attorney, Agent or Firm:
Saegusa International Patent Office