Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2716962
Kind Code:
B2
Abstract:
PURPOSE: To provide a semiconductor device excellent in characteristics such as low stress, heat resistance and moisture resistance and high in reliability by using a special component composition as an epoxy resin composition used for resin sealants.
CONSTITUTION: The semiconductor device is produced by sealing a semiconductor with an epoxy resin composition comprising the following components (A), (B), (C), (D) and (E) in a (component D)/(component E) weight ratio of 15/85 to 60/40. (A) An epoxy resin. (B) A novolack phenolic resin. (C) An organopolysiloxane having at least one functional group selected from among epoxy group, an amino group, hydroxyl group, a mercapto group and carboxyl group. (D) Spherical amorphous silica powder. (E) Non-spherical amorphous silica powder.
Inventors:
Kimura Hideto
Kazuo Ika
Okuda Satoshi
Kazuo Ika
Okuda Satoshi
Application Number:
JP1286196A
Publication Date:
February 18, 1998
Filing Date:
January 29, 1996
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08K3/36; C08G59/20; C08G59/30; C08G59/62; C08K7/16; C08L63/00; C08L83/08; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08G59/20; C08K3/36; C08K7/16; C08L63/00; C08L83/08
Domestic Patent References:
| JP6440518A | ||||
| JP63202622A | ||||
| JP62151447A | ||||
| JP61268750A | ||||
| JP61254619A | ||||
| JP6263453A | ||||
| JP6250325A | ||||
| JP6263450A | ||||
| JP6055025A | ||||
| JP627723A |
Attorney, Agent or Firm:
Nishihiko Yasuhiko