【発明の名称】半導体装置

Title:

【発明の名称】半導体装置

Document Type and Number:

Japanese Patent JP2907765

Kind Code:

B2

Inventors:

KYOTA HISAHARU
HAYASHI HISAO
YAMOTO HISAYOSHI

Application Number:

JP30497095A

Publication Date:

June 21, 1999

Filing Date:

October 30, 1995

Export Citation:

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Assignee:

SONII KK

International Classes:

H01L29/78; H01L21/283; H01L21/314; H01L21/316; H01L21/318; H01L21/336; H01L21/768; H01L23/522; (IPC1-7): H01L29/78; H01L21/283; H01L21/314; H01L21/336; H01L21/768

Domestic Patent References:

JP59117133A
JP58207640A
JP5348474A
JP5685829A

Attorney, Agent or Firm:

Akira Koike (2 outside)

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