Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2969115
Kind Code:
B1
Inventors:
OCHIAI TATSUO
SUGIE MAMORU
INAGAMI YASUHIRO
KOIZUMI HIDEAKI
OKABASHI TAKUO
TAKEUCHI ATSUSHI
YOKOI TAKASHI
SUGIE MAMORU
INAGAMI YASUHIRO
KOIZUMI HIDEAKI
OKABASHI TAKUO
TAKEUCHI ATSUSHI
YOKOI TAKASHI
Application Number:
JP33461498A
Publication Date:
November 02, 1999
Filing Date:
November 25, 1998
Export Citation:
Assignee:
HITACHI SEISAKUSHO KK
International Classes:
G06F15/16; G06F15/18; G06F15/80; G06N3/063; (IPC1-7): G06F15/16; G06F15/16; G06F15/18
Other References:
日立マイコン技報Ｖｏｌ．８，Ｎｏ．１ ｐ２−１０ １９９４
Attorney, Agent or Firm:
Akio Takahashi (1 person outside)