Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3793752
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that can inhibit displacement in the thickness direction of a die pad 2 due to thermal expansion of a die pad support 3.
SOLUTION: The semiconductor device has a die pad 2, a die pad support 3 for supporting the die pad 2, a plurality of inner leads 4 whose tips are arranged in the vicinity of the die pad 2, and a semiconductor element 11 that is mounted to the die pad 2 and has external dimensions which are larger than those of the die pad 2. In this case, as the shape of the die pad support 3, a stress-relieving section 7 is provided in a region that is positioned between the die pad 2 and the tip of the inner lead 4, and the semiconductor element 11 is arranged on the stress-relieving section 7.
Inventors:
Toshihiko Iwakiri
Application Number:
JP2002363567A
Publication Date:
July 05, 2006
Filing Date:
May 31, 2000
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
Miyazaki Oki Electric Co., Ltd.
Miyazaki Oki Electric Co., Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP2001024132A | ||||
| JP11284121A | ||||
| JP10313090A | ||||
| JP6216303A | ||||
| JP4029361A |
Attorney, Agent or Firm:
Kenji Onishi