Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3848350
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature guarantee function for a semiconductor chip, in the semiconductor device, which includes a semiconductor chip 3, having at least one circuit element 3a and two electric terminals 3b, 3c, and at least two external lead terminals 4, 5 connected electrically to the two electric terminals 3a, 3c, respectively.
SOLUTION: In the semiconductor device, a strip-like conductor pattern 10, which is made of a metal film having a low melting point, such as a solder, is formed on a chip type board 8 adjacent to the semiconductor chip 3 or on the semiconductor chip 3 via insulating layers 9, 9'. One end of the conductor pattern 10 is connected electrically to one of the electric terminals 3b, 3c of the semiconductor chip 3, and the other end to one of the external lead terminals 4, 5.
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Inventors:
Kuriyama, Chojiro
Application Number:
JP2005000001755
Publication Date:
September 01, 2006
Filing Date:
January 06, 2005
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L23/58; H01H37/76; H01L23/58; H01H37/00; (IPC1-7): H01L23/58; H01H37/76