Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3904934
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which is capable of increasing the number of I/Os of an insulating board where a semiconductor element that is improved in heat dissipation properties and mounted through a wire bonding method, can be reduced in thickness and size, and improved in reliability.
SOLUTION: A semiconductor device is equipped with a first bonding wire 4 connected between an electrode provided on the periphery of the top surface of a semiconductor element 3 and an electrode pad around a semiconductor element 3 on the top surface of an insulating board 2, a sealing resin layer 6 covering the semiconductor element 3 and the first bonding wire 4, and a metal plate 7 which is arranged over the semiconductor element 3 and provided with an underside that is buried in the upper part of the sealing resin layer 6 and an exposed top surface. The metal plate 7 is equipped with a projection which is located at the center of the underside of the plate 7 and provided with an underside that is adjacent and opposite to the center of the top surface of the semiconductor element 3, and the underside of an overhang of the metal plate 7 is higher than the apex of the first bonding wire 4 and supported by a plurality of second bonding wires 5 which are nearly as high as the first bonding wire 4 and connected to the electrode and/or the electrode pad.
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Inventors:
Satoshi Miura
Application Number:
JP2002019537A
Publication Date:
April 11, 2007
Filing Date:
January 29, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/29; H01L23/12; H01L23/28; H01L23/31; H01L23/34; (IPC1-7): H01L23/34; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
| JP3632960B2 | ||||
| JP5063113A | ||||
| JP7335680A | ||||
| JP57128143U | ||||
| JP63033852A |
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