Title:
半導体装置
Document Type and Number:
Japanese Patent JP4049472
Kind Code:
B2
Inventors:
Okawa Shigeaki
Toshiyuki Ohkoda
Toshiyuki Ohkoda
Application Number:
JP4866299A
Publication Date:
February 20, 2008
Filing Date:
February 25, 1999
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L21/8234; H04R19/01; H01L21/3205; H01L21/8238; H01L23/52; H01L27/06; H01L27/092; H04R3/00
Domestic Patent References:
| JP3634659B2 |
Attorney, Agent or Firm:
Hiroshi Kakutani