Title:
半導体装置
Document Type and Number:
Japanese Patent JP4137845
Kind Code:
B2
Abstract:
In a semiconductor device a substrate is formed in a rectangular shape having four edges along dicing lines, and a jetty portion is formed so as to surround an actuator element and an electrode pad for signal input and output. The jetty portion is a rectangular shape having four sides and each side continuously extends along each edge of the substrate in parallel. A foreign object generated when dicing process is performed, is prevented from attaching onto the actuator element and the electrode pad because close adhesion of a protecting tape is improved by the jetty portion.
Inventors:
Kenichi Kagawa
Hachikabe Masami
Hachikabe Masami
Application Number:
JP2004160631A
Publication Date:
August 20, 2008
Filing Date:
May 31, 2004
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B81B3/00; H01L21/301; B81C1/00; G01D5/24; G01P15/08; G01P15/125; H01L29/84
Domestic Patent References:
| JP2002103300A | ||||
| JP9027466A |
Attorney, Agent or Firm:
Hidehiko Ito
Morishita Hachiro
Hiroyuki Yoshida
Morishita Hachiro
Hiroyuki Yoshida