Title:
半導体装置
Document Type and Number:
Japanese Patent JP4415921
Kind Code:
B2
Inventors:
Shinji Eiji
Teruhiko Kumada
Toshiyuki Toyoshima
Naoki Yasuda
Wei Nagae
Teruhiko Kumada
Toshiyuki Toyoshima
Naoki Yasuda
Wei Nagae
Application Number:
JP2005267805A
Publication Date:
February 17, 2010
Filing Date:
September 15, 2005
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/312; C08G79/08; H01L21/768; H01L23/522
Domestic Patent References:
| JP2001015595A | ||||
| JP2000340689A | ||||
| JP2001015496A | ||||
| JP7126393A | ||||
| JP2002317049A | ||||
| JP2002347163A |
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka