Title:
半導体装置
Document Type and Number:
Japanese Patent JP4591071
Kind Code:
B2
Inventors:
Masato Ono
Hiroto Tamaki
Takeshi Junji
Hiroto Tamaki
Takeshi Junji
Application Number:
JP2004368163A
Publication Date:
December 01, 2010
Filing Date:
December 20, 2004
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48; C09K11/08; C09K11/59; C09K11/62; C09K11/66; C09K11/73; C09K11/80; H01L33/06; H01L33/32; H01L33/42; H01L33/50; H01L33/56; H01L33/58; H01L33/62; H01L33/64
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