Title:
半導体装置
Document Type and Number:
Japanese Patent JP4679106
Kind Code:
B2
Abstract:
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.
Inventors:
Kazuo Nishi
Hiroki Adachi
Naoto Kusumoto
Yusuke Sugawara
Hidekazu Takahashi
Yamada Daiki
Hiwa Yoshikazu
Hiroki Adachi
Naoto Kusumoto
Yusuke Sugawara
Hidekazu Takahashi
Yamada Daiki
Hiwa Yoshikazu
Application Number:
JP2004292650A
Publication Date:
April 27, 2011
Filing Date:
October 05, 2004
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/60; H01L27/14; H01L23/12; H01L23/498; H01L27/146; H01L31/0203; H01L31/04; H01L31/10
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