Title:
半導体装置
Document Type and Number:
Japanese Patent JP4917112
Kind Code:
B2
Abstract:
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion.
Inventors:
Yoshihiko Shimanuki
Application Number:
JP2009013905A
Publication Date:
April 18, 2012
Filing Date:
January 26, 2009
Export Citation:
Assignee:
Renesas Electronics Corporation
Renesas Northern Japan Semiconductor Co., Ltd.
Renesas Northern Japan Semiconductor Co., Ltd.
International Classes:
H01L23/50; H01L21/56; H01L23/31; H01L23/495
Domestic Patent References:
| JP200012758A | ||||
| JP1174440A | ||||
| JP98205A | ||||
| JP730036A | ||||
| JP3232264A |
Foreign References:
| WO2001003186A1 |
Attorney, Agent or Firm:
Yamato Tsutsui