Title:
半導体装置
Document Type and Number:
Japanese Patent JP5439727
Kind Code:
B2
Inventors:
Kenichi Sawada
Yasuo Namagawa
Takashi Tsukino
Yasuo Namagawa
Takashi Tsukino
Application Number:
JP2008056610A
Publication Date:
March 12, 2014
Filing Date:
March 06, 2008
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/337; H01L21/3205; H01L21/768; H01L23/522; H01L27/098; H01L29/417; H01L29/808
Domestic Patent References:
| JP6163604A | ||||
| JP2000049169A | ||||
| JP3016242A | ||||
| JP2002110700A | ||||
| JP3270023A | ||||
| JP2005303137A | ||||
| JP2005191052A | ||||
| JP2007273918A | ||||
| JP2005310923A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa