Title:
半導体装置
Document Type and Number:
Japanese Patent JP5547022
Kind Code:
B2
Inventors:
Masaki Konishi
Fujiwara Hirokazu
Jun Morimoto
Takeshi Endo
Morino Friend student
Ishikawa 剛
Takashi Katsuno
Yukihiko Watanabe
Fujiwara Hirokazu
Jun Morimoto
Takeshi Endo
Morino Friend student
Ishikawa 剛
Takashi Katsuno
Yukihiko Watanabe
Application Number:
JP2010224226A
Publication Date:
July 09, 2014
Filing Date:
October 01, 2010
Export Citation:
Assignee:
Toyota Motor Corp.
Denso, Inc.
Toyota Central R&D Labs., Inc.
Denso, Inc.
Toyota Central R&D Labs., Inc.
International Classes:
H01L29/78; H01L21/336; H01L27/04; H01L29/12; H01L29/739
Attorney, Agent or Firm:
Patent business corporation KAI-U Patent Law Firm