Title:
半導体装置
Document Type and Number:
Japanese Patent JP5601072
Kind Code:
B2
Inventors:
Akio Iwabuchi
Hironori Aoki
Hironori Aoki
Application Number:
JP2010174255A
Publication Date:
October 08, 2014
Filing Date:
August 03, 2010
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L21/3205; H01L21/28; H01L21/338; H01L21/60; H01L21/768; H01L23/522; H01L29/06; H01L29/41; H01L29/778; H01L29/812
Attorney, Agent or Firm:
Ditch Shiroyuki
Yukihiko Maejima
Yukihiko Maejima