Title:
半導体装置
Document Type and Number:
Japanese Patent JP5812774
Kind Code:
B2
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Inventors:
Yusuke Edo
Seiji Kamada
Seiji Kamada
Application Number:
JP2011195708A
Publication Date:
November 17, 2015
Filing Date:
September 08, 2011
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H03H17/00; H03H17/02; H03M3/02
Domestic Patent References:
| JP5299973A | ||||
| JP8065165A | ||||
| JP2010166268A |
Attorney, Agent or Firm:
Shizuyo Tamamura