Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP5996328
Kind Code:
B2
Abstract:
This semiconductor device includes: a substrate; a semiconductor element mounted on one surface of the substrate and having a functional region formed on an upper surface; a first translucent member layered on the functional region of the semiconductor element; and a sealing member, formed on one surface of the substrate, for covering the circumference of the semiconductor element and the circumference of the first translucent member and thereby sealing the first translucent member. The sealing member covers a region no greater than the lower half the thickness of the first translucent member.
Inventors:
Kenjiro Ayano
Shin Saki Shinichi
Shuji Inoue
Shin Saki Shinichi
Shuji Inoue
Application Number:
JP2012180509A
Publication Date:
September 21, 2016
Filing Date:
August 16, 2012
Export Citation:
Assignee:
Aoi Electronics Co., Ltd.
International Classes:
H01L27/14; H01L23/28; H04N5/369
Domestic Patent References:
| JP2008182051A | ||||
| JP2008288327A | ||||
| JP2000323614A | ||||
| JP2009135263A | ||||
| JP2011054925A |
Attorney, Agent or Firm:
Fuyuki Nagai
Sekine
Sekine