Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6004579
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of effectively reducing wiring resistance and parasitic inductance at a low manufacturing cost.SOLUTION: According to the semiconductor device 20, slender conductors 24 are overlapped along the extension direction of a ground line 23 and a ground terminal of a semiconductor element 22 is electrically connected with the conductor 24 to increase its cross section. Thus, the wiring resistance and parasitic inductance of the semiconductor device 20 can be reduced, thereby achieving reduction in power consumption of the semiconductor device 20.
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Inventors:
Hideaki Ogase
Arioka Yuki
Arioka Yuki
Application Number:
JP2013049424A
Publication Date:
October 12, 2016
Filing Date:
March 12, 2013
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
| JP2010258485A | ||||
| JP2000031325A | ||||
| JP11017047A | ||||
| JP2005101353A | ||||
| JP2008147307A | ||||
| JP2012023404A | ||||
| JP2012023403A | ||||
| JP2011119489A | ||||
| JP2013258387A |
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Hiroshi Masui
Toshio Komuro
Yasushi Matsunuma
Hiroshi Masui
Toshio Komuro