Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6101747
Kind Code:
B2
Abstract:
A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
Inventors:
Yoshi I Motoharu
Kichi Shingo Ta
Yasumasa Kasuya
Toichi Nagahara
Akihiro Kimura
Kenji Fujii
Kichi Shingo Ta
Yasumasa Kasuya
Toichi Nagahara
Akihiro Kimura
Kenji Fujii
Application Number:
JP2015132899A
Publication Date:
March 22, 2017
Filing Date:
July 01, 2015
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP8213422A | ||||
| JP2001185552A | ||||
| JP2005108954A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Kyoumura Junji
Mio Kawasaki
Kyoumura Junji
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