Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6164092
Kind Code:
B2
Abstract:
A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.
Inventors:
Moto Kubota
Application Number:
JP2014002880A
Publication Date:
July 19, 2017
Filing Date:
January 10, 2014
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP7085756A | ||||
| JP2006324393A | ||||
| JP2000190298A | ||||
| JP2004342553A |
Attorney, Agent or Firm:
Akira Hirakawa
Daisuke Takada
Daisuke Takada