Title:
半導体装置
Document Type and Number:
Japanese Patent JP6416488
Kind Code:
B2
Inventors:
Kazunori Yamashita
Application Number:
JP2014072334A
Publication Date:
October 31, 2018
Filing Date:
March 31, 2014
Export Citation:
Assignee:
Mega Chips Co., Ltd.
International Classes:
G06F13/28; G06F13/36; G06F13/42
Domestic Patent References:
| JP9081500A |
Attorney, Agent or Firm:
Hide Tanaka Tetsu
Hideaki Shioya
Hideaki Shioya