Title:
半導体装置
Document Type and Number:
Japanese Patent JP6445673
Kind Code:
B2
Inventors:
Masaru Sekiguchi
Application Number:
JP2017254804A
Publication Date:
December 26, 2018
Filing Date:
December 28, 2017
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
G01R19/00; H02J7/02
Domestic Patent References:
| JP2002148286A | ||||
| JP2005033558A | ||||
| JP2002139523A | ||||
| JP2006153780A | ||||
| JP2007232417A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda