Title:
半導体装置
Document Type and Number:
Japanese Patent JP6490027
Kind Code:
B2
Abstract:
Provided is a semiconductor device capable of having simple wiring in mounting the semiconductor device. The semiconductor device includes at least one P-terminal, at least one N-terminal, a power output terminal, at least one power supply terminal, at least one ground (GND) terminal, at least one control terminal, and a package that is rectangular in a plan view and accommodates an insulated gate bipolar transistor (IGBT) being a high-side switching element, an IGBT being a low-side switching element, and a control circuit. The at least one control terminal is disposed on a first side of the package, opposite to a second side on which the power output terminal is disposed. The at least one P-terminal, the at least one N-terminal, the at least one power supply terminal, and the at least one GND terminal are disposed on a third side of the package, orthogonal to the second side.
Inventors:
Hiroyuki Nakamura
Application Number:
JP2016115994A
Publication Date:
March 27, 2019
Filing Date:
June 10, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP2002057282A | ||||
| JP2000308364A | ||||
| JP2012190833A |
Foreign References:
| WO1998010508A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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