Title:
半導体装置
Document Type and Number:
Japanese Patent JP6743802
Kind Code:
B2
Abstract:
A semiconductor device according to an embodiment of the disclosure includes a base, a semiconductor element, a first conductor, and a second conductor. The base has an outer edge including a first part, a second part, and a third part. The first part and the second part are substantially parallel to each other. The third part extends in a direction that intersects both of the first part and the second part. The semiconductor element is covered with the base. The first conductor is coupled to the semiconductor element, and protrudes to an outside of the base from the first part of the outer edge. The second conductor is coupled to the semiconductor element, and protrudes to the outside of the base from the third part of the outer edge.
Inventors:
Naojo Ota
Keita Miyaji
Keita Miyaji
Application Number:
JP2017224288A
Publication Date:
August 19, 2020
Filing Date:
November 22, 2017
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L23/50; H01L23/12; H01L25/00
Domestic Patent References:
| JP2000124380A | ||||
| JP2009129952A | ||||
| JP2010080914A | ||||
| JP1230263A |
Attorney, Agent or Firm:
Patent Business Corporation Tsubasa International Patent Office