Title:
半導体装置
Document Type and Number:
Japanese Patent JP6849660
Kind Code:
B2
Abstract:
In semiconductor device, a substrate unit includes an insulating substrate, a first conductor substrate and a second conductor substrate which are disposed on one main surface of the insulating substrate and spaced apart from each other, and a third conductor substrate which is disposed on the other main surface opposite to the one main surface of the insulating substrate. A terminal is connected to a surface of a semiconductor element opposite to the first conductor substrate. The terminal extends from a region above the semiconductor element to a region above the second conductor substrate while being connected to the second conductor substrate. At least a part of the terminal, the substrate unit and the semiconductor element is sealed by a resin. The third conductor substrate is exposed from the resin.
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Inventors:
Yousuke Nakata
Tatsuya Kawase
Mikio Ishihara
Noboru Miyamoto
Tatsuya Kawase
Mikio Ishihara
Noboru Miyamoto
Application Number:
JP2018508340A
Publication Date:
March 24, 2021
Filing Date:
April 01, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| JP2009124082A | ||||
| JP2012043875A | ||||
| JP2006237419A | ||||
| JP2005057235A | ||||
| JP2004311685A | ||||
| JP2014150203A |
Attorney, Agent or Firm:
Fukami patent office