Title:
半導体装置
Document Type and Number:
Japanese Patent JP6860334
Kind Code:
B2
Abstract:
A semiconductor device includes a semiconductor chip having a first surface, a first electrode and a second electrode provided on the first surface, a wiring electrically connected to the first electrode at the first surface, a first metal layer on the first surface and directly contacting the second electrode, a thickness of the first metal layer in a direction orthogonal to the first surface being greater than a height of a topmost portion of the wiring in the first direction from the first surface, and a resin package contacting the semiconductor chip, the first metal layer, at least a portion of the wiring, and a first portion of the first surface and leaving a second portion of the first surface exposed.
More Like This:
| JPS6178149 | SEMICONDUCTOR DEVICE |
| WO/2004/114407 | OPTIMIZED MULTI-APPLICATION ASSEMBLY |
| JPS6230356 | SEMICONDUCTOR PACKAGE |
Inventors:
Masaya Tonetate
Application Number:
JP2016236918A
Publication Date:
April 14, 2021
Filing Date:
December 06, 2016
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation
International Classes:
H01L23/48; H01L21/3205; H01L21/768; H01L23/36; H01L23/50; H01L23/522; H01L25/07; H01L25/18; H01L29/739; H01L29/78
Domestic Patent References:
| JP2011216822A | ||||
| JP2006352080A | ||||
| JP2015149508A | ||||
| JP2005158871A |
Foreign References:
| US20070145582 | ||||
| US20110221005 | ||||
| WO2013105161A1 |
Attorney, Agent or Firm:
Takumi Hara
Minoru Watanabe
Minoru Watanabe