Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0210871
Kind Code:
A
Abstract:
PURPOSE: To prevent Au from being laterally diffused by providing metal wirings formed by sequentially laminating a Mo layer, a Ti layer and an Au layer to become barrier metal on a board.
CONSTITUTION: A Ti layer 2 is provided between a Mo layer 3 and an Au layer 4 as a Ti/Mo/Ti/Au layer structure. Thus, after wiring metal is formed, it is heat treated to improve its reliability without reacting the Au layer with a base.
Inventors:
FUJII TAKAYUKI
Application Number:
JP16284088A
Publication Date:
January 16, 1990
Filing Date:
June 29, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/52; H01L21/28; H01L21/3205; H01L21/768; H01L29/43; (IPC1-7): H01L21/3205; H01L21/88; H01L21/90; H01L29/46
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Next Patent: JPH0210872