PURPOSE: To notably enhance the bond properties of a semiconductor chip onto a mold resin for avoiding the cracking in a package by removing the organic pollutants at least on the surface of the semiconductor chip.
CONSTITUTION: In order to remove pollutants 8, the oxygen in dry air (or air) is turned into ozone in high energetic state by ultraviolet ray (a) excitation so as to decompose and remove the organic pollutants 8 by the ozone radicals. At this time, numerous OH radicals are formed on the surface of a semiconductor chip 5 to be turned in hydrophilic state having no organic pollutants at all so that the O-H coupling of OH radicals on the semiconductor chip surface (a) with the organic matters comprising a mold resin 11 may be facilitated to make the semiconductor chip 5 firmly bond onto the mold resin 11.
FUKAZAWA HIROYUKI
OIDE TOMOSHI
KOJIMA AKIRA
