PURPOSE: To provide a semiconductor device in which it is possible to perform reflow mounting with high accuracy and which is favorable in heat radiation property.

CONSTITUTION: This is equipped with leads 5, a TAB film 1, which has a device hole 2, a semiconductor pellet 7, which is connected electrically with the leads, being arranged in the device hole 2, and ring-shaped insulating substances 101 and 102, which are attached to catch the leads 5, on the TAB film 1 outside the device hole 2. According to this constitution, since the ring-shaped insulators 10 and are attached to the catch the leads 6, the warp of the TAB film can also be prevented. Moreover, since the insulators 101 and 102 are ring-shaped, the rear of the pellet 7 can be exposed to outside, and the heat radiation property can be improved.