Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH06163753
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor device wherein its moisture-resistant reliability, its heat-resistant reliability and its mechanical strength are excellent and it has been resin-sealed with a sealing resin.
CONSTITUTION: A semiconductor device is formed in such a way that a semiconductor element has been sealed with a resin composition which contains a maleimide compound as a main-ingredient component and which contains a phenol compound, a vinylbenzyl compound and, preferably, a hardening catalyst as the hardening agent of the maleimide compound.
Inventors:
MITSUOKA YOSHIAKI
MORIKAWA KEICHU
MORIKAWA KEICHU
Application Number:
JP31198392A
Publication Date:
June 10, 1994
Filing Date:
November 20, 1992
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C08F222/40; C08F22/36; C08F26/00; C08F226/02; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08F222/40; C08F226/02; H01L23/31
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