PURPOSE: To enable moisture to be less expanded so as to protect a package against cracking by a method wherein a reflecting body which reflects light as wide in area as the size of a semiconductor chip is provided in a molding resin package.

CONSTITUTION: A reflector 12a is so embedded in the upper part of a molding- resin package 11 as to cover a semiconductor chip 21. As IR rays irradiating the upside of the molding resin package 11 are reflected by the reflector 12a, IR rays are prevented from impinging directly on molding resin just above the semiconductor chip 21, so that resin hardly rises in temperature, moisture contained in the package 11 is prevented from expanding, and consequently the package 11 can be protected against cracking.