Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0653449
Kind Code:
A
Abstract:
PURPOSE: To obtain a semiconductor device provided with power supply wiring for feeding a single chip gate array with a plurality of power supply voltages.
CONSTITUTION: The semiconductor device comprises a plurality of power supply wirings (first and second power supply wirings 1, 2) arranged through a microspace on the surface of a gate array, and a pattern 5 for interconnecting the power supply wirings, wherein power supply wiring is formed individually for a plurality of regions 3, 4 through selective connection of the power supply wirings.
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Inventors:
HORIKOSHI KENGO
Application Number:
JP22518292A
Publication Date:
February 25, 1994
Filing Date:
July 31, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/82; H01L21/822; H01L27/04; H01L27/118; (IPC1-7): H01L27/118; H01L21/82; H01L27/04
Attorney, Agent or Firm:
Suzuki Akio