To provide a semiconductor device, which can prevent the short circuit between lead terminals when electric-characteristic test is performed.

A plurality of outlet ports 3 are formed in the zigzag pattern in a package 1 of an LSI. A checking terminal 4 for contact with an inspecting probe is drawn out through the outlet port 3. The checking terminal 4 is approximately flush with an upper surface part 1e of the package 1, and the tip of the terminal forms a hook shape. Therefore, the special allowance is formed between the respective checking terminals, and the erroneous contact of the probe can be prevented. Furthermore, the dimensions of the outer shape of the LSI, when the checking terminals are not provided, are not changed, and the extra mounting space for the checking terminal is not required. Furthermore, since the tip is formed in the hook shape, the probe can be brought into contact with the checking terminal readily and securely and becomes hard to be disengaged.