To apply a pressure uniformly onto a tape with a tool to uniformly bring the tape into close contact with a chip so as to keep the chip free from a bonding failure and high in reliability by a method wherein plating is performed corresponding to all the area of a lead where the tape is stuck.

Bonding pads 9 formed in rectilinear rows are provided onto a semiconductor chip 1, and a plating layer 4 equal to or larger than the adhesive area of a tape bonded to the underside of a lead 3 is provided to the upside of the lead 3. An adhesive tape 2 is stuck to the semiconductor chip 1 in the direction in which the bonding pads 9 are arranged, and the leads 3 are laid on the tape 2. Then, the lead 3 is pressed against the adhesive tape 2 by a tool to bond the tape 2 to the chip 1. The plating layer 4 is present on the tape 2 through the intermediary of the lead 3, so that a force applied by the tool is uniformly applied to the tape 2, and the lead 3, the tape 2, and the chip 1 are uniformly bonded together.