Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5350675
Kind Code:
A
Abstract:
PURPOSE: To achieve the improvement in packaging density and the reduction in the kinds of parts by opposing a pair of substrates of the same shape leaving a required spacing on their inside and hermetically bonding the circumeferential parts of both substrates with a bonding material.
Inventors:
OOYAGI SADAKICHI
Application Number:
JP12495376A
Publication Date:
May 09, 1978
Filing Date:
October 20, 1976
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/50; H01L23/02; H01L23/12; (IPC1-7): H01L23/02; H01L23/12