Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5372567
Kind Code:
A
Abstract:
PURPOSE:To prevent breakage of the wafer by providing a reinforcing protrusion on one surface of a semiconductor wafer.
Inventors:
SADAMORI MASAAKI
Application Number:
JP14885276A
Publication Date:
June 28, 1978
Filing Date:
December 10, 1976
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L29/74; H01L21/02; H01L21/302; (IPC1-7): H01L21/302; H01L29/74