Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5619634
Kind Code:
A
Abstract:
PURPOSE:To easily and exactly bring a probe into contact with the semiconductor device of multilayer wiring architecture by forming a contacting portion for measuring stylus wider than any between the contacting portion of the lower wiring layer with upper wiring layer with connecting portion of the element. CONSTITUTION:An SiO2 film 11 is formed on an Si semiconductor chip 10, an upper layer wiring connector 12a, a measuring contact portion 12b, and an element connecting portion 12c are provided to be connected to a circuit block 13. An SiO2 film 14 is coated thereon, an opening is perforated at the connecting portion 12a, and is connected to the upper wiring layer 15. Since there is a wider portion 12b than any between the connecting portions 12a and 12c, this configuration can easily and exactly bring the measuring stylus into contact with the wide portion 12b so as to exactly supply operation voltage to the circuit block 13 from the stylus. Accordingly, it can smoothly execute the analysis of improper portion.
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Inventors:
ITOU KAZUO
Application Number:
JP9501379A
Publication Date:
February 24, 1981
Filing Date:
July 27, 1979
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/66; G01R31/26; (IPC1-7): G01R31/26
Domestic Patent References:
| JPS5323570A | 1978-03-04 | |||
| JPS5441080A | 1979-03-31 |