Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5923525
Kind Code:
A
Abstract:
PURPOSE:To prevent the void in a package and the resin gap in a lead interface from occurring in a resin package type semiconductor device to form transfer or injection, by a method wherein distance between a gate of a resin forcing mold and a lead wire nearest to the gate is specified during the package forming. CONSTITUTION:A semiconductor pellet 2 is put onto center fixing part of a lead frame 1, and resin is injected from a resin forcing gate 4 provided on one side of a cavity thereby resin mold type semiconductor is formed. In this constitution, distance between the gate 4 and a lead wire 5 nearest to the gate is specified to 0.9-1.1mm.. Thus both void in a package and resin gap in a lead interface can be prevented simultaneously and anti-humidity of the package is improved and deformation of a tab is prevented.
Inventors:
SUZUKI AKIRA
ITOU FUJIO
NISHIDA TAKAFUMI
ITOU FUJIO
NISHIDA TAKAFUMI
Application Number:
JP13198082A
Publication Date:
February 07, 1984
Filing Date:
July 30, 1982
Export Citation:
Assignee:
HITACHI LTD
HITACHI MICROCUMPUTER ENG
HITACHI MICROCUMPUTER ENG
International Classes:
B29C45/00; B29B7/00; B29C35/00; B29C39/00; B29C39/10; B29C39/26; B29C43/00; B29C45/02; B29C45/14; B29C45/26; H01L21/56; H01L23/50; (IPC1-7): B29C6/00; B29F1/10; B29G3/00; H01L23/48
Domestic Patent References:
| JPS53100773A | 1978-09-02 |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)