Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS60128626
Kind Code:
A
Abstract:
PURPOSE:To contrive economization of gold by a method wherein the part requiring no gold-plating is coated by an alumina film before the plating is performed so that gold will not be plated there. CONSTITUTION:A metallized layer is formed on the alumina green sheet whereon a semiconductor substrate 1 will be formed by performing a screen printing using W, Mo and the like. Alumina paste is coated on the part required for bonding of the tip of a lead 3, 0.2-0.3mm. for example, by performing a sintering at approximately 1,500 deg.C for example, and an alumina sintered film 7 is formed. At this time, a ceramic substrate 1 whereon an alumina green sheet is sintered is formed. Subsequently, Ni is electroplated on the minimum area required on the lead, and then Au is electroplated thereon.
Inventors:
MIZUNO TOSHIAKI
Application Number:
JP23613183A
Publication Date:
July 09, 1985
Filing Date:
December 16, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Akio Takahashi