PURPOSE: To obtain the titled device of excellent cooling effect by a method wherein a cooling liquid flowing through a cooling device which hermetically seals a semiconductor module is brought into direct contact with the backs of semiconductor chips, and the upper surface of module other than those is covered with a member not passing the cooling liquid.

CONSTITUTION: Semiconductor chips 3 are bonded on a module substrate 4, and a thermosetting resin 8 is uniformly applied thin on the back surfaces of the chips 3. After the resin is hardened, the joint of the substrate 4 with the cooling device 7 and the sections of backs of the chips are selectively removed. Next, passing the cooling liquid 6 under the junction of the device 7 enables to prevent the characteristic deterioration due to the liquid and then to obain excellent cooling effect.