Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS61202443
Kind Code:
A
Abstract:
PURPOSE:To improve the pattern matching accuracy of an inserting member to a semiconductor element by surrounding the inserting member, the semiconductor element and a supporting member with a surrounding member, and filling a fixing material among the inner periphery of the surrounding member, the inserting member and the outer periphery of the semiconductor element. CONSTITUTION:A guide ring 7 made of silicon rubber is provided to surround an inserting metal plate 5, a semiconductor element 1 and a supporting metal plate 2. slight clearance of the degree that the plate 5 and the element 1 are entered in the ring 7 is provided amount the inner periphery of the ring, the outer periphery of the plate 5 and the outer periphery of the element 1. Four through holes 9 are formed at the ring 7. Fixing silicon rubber 8 is coated and filled among the holes 9, the inner periphery of the ring 7, the outer periphery of the plate 5 and the outer periphery of the element 1. Thus, the pattern matching accuracy of the plate 5 and the element 1 is improved.
Inventors:
KONISHI YUZURU
Application Number:
JP4505685A
Publication Date:
September 08, 1986
Filing Date:
March 05, 1985
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/52; H01L21/58; H01L29/74; (IPC1-7): H01L29/74
Attorney, Agent or Firm:
Masuo Oiwa