Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS61218145
Kind Code:
A
Abstract:
PURPOSE:To prevent a wiring lead from an external connection terminal from being improperly disconnected by leading wirings led from the terminal of a semiconductor device from the wiring layer except the uppermost wiring layer of three laminated wiring layers. CONSTITUTION:Three layers 2, 4, 6 of aluminum films of the extension of aluminum wirings are superposed without intermediary of insulating films therebetween on an Si semiconductor substrate 1. Thus, a bonding pad made of one thick aluminum film is composed. The bonding is performed on a bonding area 9. Interlayer insulating films 3, 5 made of polyimide resin and the final protective insulating film 8 made of polyimide resin are formed on the three layers. Aluminum wirings 12 are led partly from the film 4 of the second layer. The first aluminum wiring layer 14 is connected via a through hole 13 opened at the film 5 with respect to the wirings 12.
Inventors:
FUKUSHIMA TAKEKI
Application Number:
JP5835485A
Publication Date:
September 27, 1986
Filing Date:
March 25, 1985
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/52; H01L21/31; H01L21/3205; (IPC1-7): H01L21/94
Attorney, Agent or Firm:
Katsuo Ogawa