Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6122659
Kind Code:
A
Abstract:
PURPOSE: To prevent the corrosion of wiring by a method wherein an opening part is formed on a final passivation film, and alluminum nickel alloy is cladded to this opening.
CONSTITUTION: A pellet 3 is attached to a tab 1 interposing a blazing material such as gold-silicon eutectic crystals etc. A wiring 9 and a final passivation film 8 are provided on the pellet 3. The opening part 10 is formed by etching at the determined position of the film 8, and a part of the wiring 9 is exposed. Aluminum-nickel alloy is cladded at the opening part 10 at the condition the surrounding of said alloy is extended on the upper surface of the film 8.
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Inventors:
KEIDA HARUO
Application Number:
JP14234284A
Publication Date:
January 31, 1986
Filing Date:
July 11, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; H01L23/485; (IPC1-7): H01L21/60; H01L23/48
Attorney, Agent or Firm:
Akio Takahashi