Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6218740
Kind Code:
A
Abstract:
PURPOSE: To obtain a high moisture-resistance semiconductor device by coating the surface of an inner layer resin for protecting a semiconductor chip with an alumina film.
CONSTITUTION: The electrodes of a semiconductor chip 1 are connected to outer leads 3 with fine metal wirings 4. The whole is protected with Si resin 5 of high purity, coated with an alumina film 6 having extremely small moisture- permeability on the outer surface, and enclosed on the outer surface with epoxy resin to complete the titled device.
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Inventors:
IGA YOICHI
Application Number:
JP15861785A
Publication Date:
January 27, 1987
Filing Date:
July 17, 1985
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/29; H01L23/31; (IPC1-7): H01L23/30
Attorney, Agent or Firm:
Uchihara Shin
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