PURPOSE: To reduce a connecting resistance and to stabilize the operation of a laser element by bridging the upper face of a semiconductor element to the terminal with a metal having a brazing material on its partial or whole surface or a thin dielectric plate having a small electric resistance.

CONSTITUTION: A submount 3 is formed on a stem 4, and a semiconductor laser element 2 is secured onto the submount 3. The upper face of the element 2 is bridged to be connected to a connecting terminal 5 provided on the step 4 with a thin conductive plate 1 having a large sectional area. The plate 1 is formed of a metal plate having a brazing material on its partial or whole surface, or a dielectric having a low electric resistance. Thus, since the electric resistance between the element 2 and the terminal 5 is reduced, the operation of the element 2 can be stabilized.