Title:
半導体装置、半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5778453
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure capable of improving connection reliability between a semiconductor chip and an intermediary substrate and of reducing cost, in a semiconductor device configured by laminating a plurality of semiconductor chips and having an external connection terminal on the intermediary substrate.SOLUTION: A semiconductor device has: a first semiconductor chip having a first through electrode group; a laminated second semiconductor chip having a second through electrode group and a connection terminal group, which is opposed to the first through electrode group of a rear face side of the first semiconductor chip to establish electrical conduction with the first through electrode group; a third semiconductor chip having a connection terminal group, a third through electrode group, a re-wiring layer 44 provided on a surface on an opposite side to the connection terminal group, and an anti-intermediary substrate connection terminal 61 group formed on the surface where the re-wiring layer 44 is present so as to have electrical conduction with the re-wiring layer 44 and having the minimum pitch of arrangement longer than that of the second through electrode group; and a laminated intermediary substrate 100.
Inventors:
Osamu Shimada
Takeharu Noji
Gomei Toshio
Kazuhiro Baba
Koichi Takemura
Toshikazu Okubo
Kei Shimakura
Atsushi Sakai
Masahiro Aoyagi
Katsuya Kikuchi
Takeharu Noji
Gomei Toshio
Kazuhiro Baba
Koichi Takemura
Toshikazu Okubo
Kei Shimakura
Atsushi Sakai
Masahiro Aoyagi
Katsuya Kikuchi
Application Number:
JP2011068505A
Publication Date:
September 16, 2015
Filing Date:
March 25, 2011
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
Shinko Electric Industry Co., Ltd.
Toppan Printing Co., Ltd.
IBIDEN CO.,LTD.
National Institute of Advanced Industrial Science and Technology
Shinko Electric Industry Co., Ltd.
Toppan Printing Co., Ltd.
IBIDEN CO.,LTD.
National Institute of Advanced Industrial Science and Technology
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2011081882A | ||||
| JP2006222252A | ||||
| JP2007180303A | ||||
| JP2006216755A | ||||
| JP2007036104A |
Foreign References:
| US20110057819 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
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