Title:
Semiconductor devices, measuring instruments, and methods for manufacturing semiconductor devices
Document Type and Number:
Japanese Patent JP6363273
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device, a measuring apparatus and a method of manufacturing a semiconductor device, capable of suppressing fluctuation in frequency of an electronic component.SOLUTION: A semiconductor device includes a lead frame including a plurality of inner leads formed around a die pad, a first electronic component mounted in a first mounting region on one surface of the die pad, a second electronic component mounted in a second mounting region on one surface of the die pad, a first sealing member for sealing the first electronic component, a first electronic component sealed with the first sealing member, and a second sealing member which seals the second electronic component. The first electronic component is connected to the second electronic component through a first bonding wire, and the second electronic component is connected to the inner lead through a second bonding wire.SELECTED DRAWING: Figure 3
Inventors:
Kengo Takemasa
Application Number:
JP2017135681A
Publication Date:
July 25, 2018
Filing Date:
July 11, 2017
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L23/29; G01R22/06; H01L21/60; H01L23/28; H01L23/31; H01L25/04; H01L25/18
Domestic Patent References:
| JP2005303222A | ||||
| JP2007194623A | ||||
| JP2011049421A | ||||
| JP9289269A | ||||
| JP2114553A |
Foreign References:
| US20060027479 | ||||
| WO2007020701A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda