Title:
半導体装置、および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4322903
Kind Code:
B2
Abstract:
The semiconductor apparatus includes: a conductor section provided on a surface of a semiconductor chip so as to input and output an electric signal; and an external connection terminal provided on the surface of the conductor section so as to joint the conductor section to a package substrate, wherein the conductor section has a through hole provided on the surface of the conductor section and piercing a center of the surface of the conductor section, and the external connection terminal is formed along the through hole. As a result, it is possible to realize a semiconductor apparatus whose resistance against repetitive stresses and impulse is improved and which has high packaging reliability.
Inventors:
Hiroyuki Nakanishi
Application Number:
JP2006232810A
Publication Date:
September 02, 2009
Filing Date:
August 29, 2006
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/60; H01L21/3205; H01L23/52
Domestic Patent References:
| JP8274211A | ||||
| JP2001077517A | ||||
| JP2005294483A | ||||
| JP2004095885A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office